CONDITIONING OF A SUBSTRATE FOR ELECTROLESS DIRECT BOND PLATING IN HOLES AND ON SURFACES OF A SUBSTRATE

摘要

CONDITIONING OF A SUBSTRATE FOR ELECTROLESS DIRECT BOND PLATING IN HOLES AND ON SURFACES OF A SUBSTRATE A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and/or on the surfaces of the substrate. The copolymer material contains at least two ionic moieties of a charge opposite from the charge associated with catalyst particles to be subsequently applied prior to the deposition of the conductive metal.