Gang bonding interconnect tape for semiconductive devices and method of making same,申请号US19790037181-传众专利搜索

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发明名称	Gang bonding interconnect tape for semiconductive devices and method of making same
摘要
申请公布号	USRE31967(E)	申请公布日期	1985.08.13
申请号	US19790037181	申请日期	1979.05.07
申请人		发明人
分类号	H01L21/48;H01L21/60;H01L23/48;H01L23/495;H01L23/50;H05K1/00;H05K3/00;H05K3/12	主分类号	H01L21/48
代理机构		代理人
主权项
地址

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