| 摘要 |
PURPOSE:To realize miniaturization by inserting an insulation layer between a center conductor of a coupling slot line and a connecting part of the center conductor and a conductor layer so as to constitute the circuit only on the semiconductor substrate. CONSTITUTION:The slot lines 22, 23 and a coplanar line 4 are connected mutually, an input signal from a port 39 of the line 24 is converted into the mode of the lines 22, 23 and an output is obtained from ports 37, 38. Moreover, the input signal from the port 37 is transmitted through the lines 23, 24 respectively via the line 22 and an output is obtained from ports 38, 39. Since the thickness of an insulation layer 36 is manufactured so that the coupling between the lines is minimized, the layer is applied to a high frequency band, and the pattern is manufactured by using only one side of the semiconductor substrate 21, and the circuit size is decreased by constituting the connecting part of the lines 22-24 with multi-layer structure. |
