| 摘要 |
A thermally stable diamond compact which has an alloy of liquidus above 700 DEG C. bonded to a surface thereof. The alloy contains at least 40 percent by weight of silver or gold or a combination thereof and 1 to 10 percent by weight of an active metal selected from the group of tungsten, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium and molybdenum and having a liquidus temperature above 700 DEG C. |
