| 摘要 |
PURPOSE:To enable continuous inspection and other operations for an SO package type IC by arranging contact probes on both sides thereof in parallel so as to approach or separate from the IC in linkage therewith. CONSTITUTION:An SO package type IC6 separated with a separation mechanism is conveyed into an IC chute 5 inclined by about 60 deg. from the level. Then, at the contact position, the IC is stopped with a stopper 7 and contact probes having contact pins 8 are moved toward IC6 from both sides thereof 6 in the chute 5. At this point, the pins 8 get in contact with terminals 4 of the IC6 and further grasp the IC6 compressing internal springs 9 thereof 8. Then, after the end of the operation such as inspection, the pins 8 are retreated to release the IC6 and the stopper 7 lowers to allow the IC6 to be discharged from the chute 5 freely dropping. Thus, the operation such as inspection of the SO package type IC can be done continuously while the simple construction enables the manufacture at a relatively low cost.
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