| 摘要 |
PURPOSE:To enable an area on a substrate occupied by a sense of contact force sensor and an IC to be reduced by facilitating wiring by a method wherein said sensor and an IC are connected via wiring on the same sheet of film carrier, and the sensor finished in such connection is fixed on the substrate. CONSTITUTION:The film carrier 20 is previously provided with leads 21A and 21B and the connection terminals thereof, where these connection terminals are made so as to come to the position of abutment with signal lead-out terminals provided on the side surfaces 4 of a sense of contact force sensors 1 and the terminals of the IC's 6. the film carrier 20 is cut along cutting lines 22 and 23 shown e.g. by broken lines, and an obtained sensor assemblage 24 is bent in the arrow direction. An attachment plane 1A is formed in the sensor 1, and the assemblage 24 is mounted on the substrate 7 via each of the attachment planes 1A. Thus, many sensors 1 and the IC's thereof can be arranged in a narrow range. |
