发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To contrive the reduction in electrode diameter, increase in integration of the titled device, and decrease in cost by a method wherein Ag or Ag alloy is used for a bonding metallic fine wire. CONSTITUTION:A forming device for a ball-up of an Ag bonding wire is provided with a nitrogen gas inflow pipe 2 in the opposite electrode 1 of an electric torch by penetration toward a discharge electrode 3, and nitrogen gas is supplied so a to blow up the pure Ag bonding metallic fine wire 5 contained in a capillary 4 from below. This manner enables the tip of the metallic fine wire 5 to be wrapped in a nitrogen gas atmosphere of oxygen concentration 100ppm or less without obstructing a flow of charge particles caused by discharge. This forming device can be easily installed to a generally used high-speed automatic bonding device, with which device the ball-up working of the pure Ag fine wire can be incorporated in the industrial production process. Of cource, another inert gas can be used in place of nitrogen.
申请公布号 JPS60153154(A) 申请公布日期 1985.08.12
申请号 JP19840008817 申请日期 1984.01.20
申请人 NIPPON DENKI KK 发明人 KAMIJIYOU ATSUSHI;IGARASHI HITOSHI;NOGUCHI SHIYOUZOU;YOTSUYANAGI KEIICHI
分类号 H01L21/60;B23K20/00 主分类号 H01L21/60
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