发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To protect the first contact of a bonding pad and a wiring to an internal element against breakage of wiring caused by corrosion by water contents by covering it with a ball of bonding wire connecting part sufficiently. CONSTITUTION:A ball 4' of a bonding wire 3' which is bonded to an opening 2' of a protective film on a bonding pad 1' is arranged on a contact 6' of the bonding pad and a wiring 5' connected to an internal element. Accordingly, it becomes possible to prevent a failure of conduction caused by progress of corrosion of aluminum in the opening part and fusion of aluminum in said part by arranging the contact under the ball. As a thickness of the ball part 4' is thick enough compared with that of the bonding pad 1', the characteristics can be maintained for a long term.
申请公布号 JPS60153134(A) 申请公布日期 1985.08.12
申请号 JP19840008809 申请日期 1984.01.20
申请人 NIPPON DENKI KK 发明人 YAMANAKA TAKASHI
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
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