HEAT TREATING DEVICE FOR PLATING DIFFUSION

摘要

PURPOSE:To form a plating diffused layer on the surface of a metallic material with ease by putting a metallic material member into a vacuum vessel and depositing a plating metal by evaporation thereon then heating the member to diffuse the plating metal into the metallic material. CONSTITUTION:A metallic member 1 consisting of a Cu alloy, etc. as a blank material is disposed in a vacuum vessel 2 and is heated to a prescribed temp. by the heating of a resistor 7 using an electric power source 8. The inside of the vessel 2 is evacuated to about 10<-5>Torr by a vacuum pump 3 and a plating metal 4 such as Sn on an evaporation tray 5 is melted and evaporated by a power source 6 to deposit Sn by evaporation on the surface of the member 1. When the thickness of the Sn film deposited by vapor deposition increases 10-20mu, the power source 6 is turned off and the vapor deposition of Sn is stopped. The material 1 is heated to >=400 deg.C in succession to diffuse the Sn deposited by evaporation into the Cn of the metallic material by which the Ni diffused layer having excellent wear resistance is formed.