发明名称 |
DIFFUSION JOINING METHOD OF COPPER AND STAINLESS STEEL |
摘要 |
PURPOSE:To join the joint surfaces of copper and/or stainless steel to be diffusion-joined under low pressure in short time and to obtain a joint part having good quality by forming an alloy layer having the m. p. lower than the m. p. of the joint surfaces to said surface. CONSTITUTION:An alloy layer having the m. p. lower than the m. p. of materials to be joined is formed to the joint surface of copper and/or stainless steel which is the material to be joined. The alloy layer surface is then positioned to face the adjacent members to be joined. The members are thereafter joined in a non-oxidizing atmosphere. The members are thus joined at the temp. lower than the m. p. of the materials to be joined under the low pressure in short time, by which the joint part having good quality is obtd. |
申请公布号 |
JPS60152382(A) |
申请公布日期 |
1985.08.10 |
申请号 |
JP19840007199 |
申请日期 |
1984.01.20 |
申请人 |
HITACHI SEISAKUSHO KK |
发明人 |
WACHI HIROSHI;FUNAMOTO TAKAO;KATOU MIZUO;TAKAHASHI KAZUYA;OGURA SATOSHI |
分类号 |
B23K20/00;B23K1/00;B23K20/227 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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