发明名称 METHOD AND APPARATUS FOR EVALUATING ELECTROLESS PLATING
摘要 A test piece is immersed in an electroless plating bath. It is then electrically charged instantaneously via a counter electrode to have a polarization potential eta (t) of a few millivolts. The charge consumed by the electroless plating reaction of the test piece is measured by a potential recorder in the form of a variation of the polarization potential eta (t) with respect to time t. The eta (t)-t relation is analyzed to obtain a resistance R of the test piece. After the potential of the test piece has returns to electroless deposition potential EELP, the test piece is charged again until its polarization potential eta (t) rises to 50 millivolts or more. A eta (t)-t relation is obtained. Based on the eta (t)-t relation, a Tafel slope beta a of anodic reaction is obtained. After the potential of the test piece has returned to electroless deposition potential EELP, the test piece is so charged for the third time as to have its polarization potential eta (t) lowered to -50 millivolts or less, and a eta (t)-t relation is obtained. This relation is analyzed to obtain a Tafel slope beta c of anodic reaction of the test piece. Based on the reaction resistance R, Tafel slopes beta a and beta c, an electroless plating current density IELP is obtained. Based on the electroless plating current density IELP, a rate of electroless plating VELP is calculated.
申请公布号 DE3070824(D1) 申请公布日期 1985.08.08
申请号 DE19803070824 申请日期 1980.03.05
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SUZUKI, MASAYUKI;SATO, YUICHI;KANNO, KEN-ICHI
分类号 G01N27/26;C23C18/31;G01N17/02;(IPC1-7):G01N17/00;G01N27/00 主分类号 G01N27/26
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