发明名称 POLISHING DEVICE
摘要 PURPOSE:To improve the efficiency of polishing work and the rate of operation of a device and prevent its damage, by charging a removable holding means, formed independently of a polishing plate, with an article to be polished when it is in an off-line and enabling the polishing plate to charge with the article to be polished and collect it for every holding means. CONSTITUTION:A pedestal 7 is left as charged with a wafer 1 in an off-line at operative time or the like of a polishing plate 2 and an abrasive disk 6, and if the plate 2 comes to a position as shown by a full line in the drawing where the wafer 1 must be set to a pedestal setting hole 8, it is charged inside with each pedestal 7 charged with the wafer 1, attractively holding the pedestal 7 by a vacuum attractive hole. Under this condition, a surface to be polished of the wafer 1 is brought into contact with the abrasive disk 6 by 180 deg. inverting the plate 2 to its position of two-dot chain line in the drawing by an arm 4 and an inverting device 5. And the abrasive disk 6, if it is further rotated by applying a load, causes the plate 2 to also start rotating due to its abrasion with the abrasive disk 6, polishing the surface to be polished of the wafer 1 to a mirror surface condition. The plate 2, if polishing is finished, is returned to the position as shown by the full line in the drawing, collecting the wafer 1 together with the pedestal.
申请公布号 JPS60150961(A) 申请公布日期 1985.08.08
申请号 JP19840003451 申请日期 1984.01.13
申请人 HITACHI SEISAKUSHO KK;HITACHI DENSHI ENGINEERING KK 发明人 SHIMURA TAKASHI;MURAKAMI KUNIHIKO;YUI HAJIME
分类号 B24B37/04;B24B37/30;B24B41/06;H01L21/304 主分类号 B24B37/04
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