摘要 |
PURPOSE:To seal a solid-state image pickup element hermetically by forming the peripheral region of a metallic frame on the optical window side in recessed structure. CONSTITUTION:A recessed section 12 is formed to a peripheral region on the optical window plate 9 side of a metallic frame 11, and fitted to an inner circumferential side wall in a metallic layer 6 on the package proper 11. Accordingly, the recessed section 12 functions as a mark when the optical window plate 9 is positioned to the package window plate 9, the optical window plate can be positioned precisely, and a chip 3 can be sealed completely by the optical window plate 9. Since the recessed section 12 is formed even through electric welding at a high temperature, strain and stress due to heat generated on sealing can be relaxed, the cracking of the optical window plate 9 is prevented, and yield can be improved. |