发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PURPOSE:To prevent the corrosion of a conductive layer, and to inhibit the deterioration of the adhesive strength of a projecting electrode and the generation of disconnection due to the corrosion of a wiring layer by coating the conductive layer with an intermediate metallic layer having corrosion resistance. CONSTITUTION:A groove 90 formed to a conductive layer 50 is formed so as to surround an opening section shaped to an insulating layer 40 and a region to which a projecting electrode 80 must be shaped. The conductive layer 50 is divided into a conductive layer 52 and a surface conductive layer 53 by the groove 90. A Ti intermediate metallic layer 61 and a Pt intermediate metallic layer 71 are formed on the conductive layer 52, but the conductive layer 52 is coated completely with either one of them such as the intermediate metallic layer 61 at that time, and the layer 61 is connected to the surface conductive layer 53 in order to shape the projecting electrode 80 through electroplating. The Au projecting electrode 80 is formed in the opening section bored to a resist layer 100 on the intermediate metallic layer 71, the resist layer 100 is removed, and the surface conductive layer 53 is removed through a dipping in an etching liquid. The conductive layer 52 is not etched excessively because it is surrounded completely by the intermediate metallic layer 61 having corrosion resistance at that time.
申请公布号 JPS60150652(A) 申请公布日期 1985.08.08
申请号 JP19840005760 申请日期 1984.01.18
申请人 OKI DENKI KOGYO KK 发明人 TOTSUKA NORIO;SUGAWARA YASUMITSU
分类号 H01L21/60 主分类号 H01L21/60
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