发明名称 SELECTIVE PLATING METHOD
摘要 PURPOSE:To form electroless plating to a prescribed pattern at a high speed by impregnating an aq. soln. contg. a specific compd. on the surface of a poor conductor of electricity, irradiating an energy beam thereto to heat the conductor and to form a nuclueous for deposition and immersing the conductor into an electroless plating liquid. CONSTITUTION:A base plate 3 consisting of a poor conductor or insulator of electricity is attached to an X-Y table 2 and the table 2 is vertically and laterally moved to as to draw a prescribed pattern on the surface of the base plate 3 on the table 2 by the command from an NC device 1. A soln. 5 contg. PdCl2 is simultaneously blown to the surface of the plate 3 from a nozzle 4 and a laser beam 8 is irradiated from a laser device 6 to the surface. The pattern part irradiated by the laser beam is locally heated and a nucleous 9 for deposition by Pd is formed in said part. Such base plate is immersed in an electroplating liquid of Ni or Cu to form an electroless plating layer 14 of Ni, Cu, etc. on the pattern formed by the nucleous 9.
申请公布号 JPS60149782(A) 申请公布日期 1985.08.07
申请号 JP19840006116 申请日期 1984.01.17
申请人 INOUE JAPAX KENKYUSHO KK 发明人 INOUE KIYOSHI
分类号 C23C18/14;C23C18/16;H05K3/18 主分类号 C23C18/14
代理机构 代理人
主权项
地址