发明名称 |
FORMATION OF ELECTROCONDUCTIVE COATING |
摘要 |
A solderable electrically conductive composition includes metallic silver particles embedded in a matrix formed from acrylic, carboxylated vinyl and epoxy. The composition is formed by dissolving acrylic powder and vinyl powder in respective solvents to form a first solution and a second solution. The solutions are then mixed with metallic silver particles and an epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvents and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix containing acrylic, vinyl and epoxy, on the substrate. |
申请公布号 |
JPS60149671(A) |
申请公布日期 |
1985.08.07 |
申请号 |
JP19840203906 |
申请日期 |
1984.09.28 |
申请人 |
EREKUTORO MATERIARUZU CORP OBU AMERIKA |
发明人 |
FURANKU UEIN MAACHIN;SAMUSON SHIYABAJI;RONARUDO JIEEMUSU SUKUUNEJIYONGEN |
分类号 |
H05K3/12;C09D5/24;C09D163/00;H01B1/22;H05K1/09 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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