发明名称 FORMATION OF ELECTROCONDUCTIVE COATING
摘要 A solderable electrically conductive composition includes metallic silver particles embedded in a matrix formed from acrylic, carboxylated vinyl and epoxy. The composition is formed by dissolving acrylic powder and vinyl powder in respective solvents to form a first solution and a second solution. The solutions are then mixed with metallic silver particles and an epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvents and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix containing acrylic, vinyl and epoxy, on the substrate.
申请公布号 JPS60149671(A) 申请公布日期 1985.08.07
申请号 JP19840203906 申请日期 1984.09.28
申请人 EREKUTORO MATERIARUZU CORP OBU AMERIKA 发明人 FURANKU UEIN MAACHIN;SAMUSON SHIYABAJI;RONARUDO JIEEMUSU SUKUUNEJIYONGEN
分类号 H05K3/12;C09D5/24;C09D163/00;H01B1/22;H05K1/09 主分类号 H05K3/12
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