| 摘要 |
PURPOSE:To provide the titled compsn. having excellent adhesion, resistance to heat and chemicals, etc. and suitable for use in the production of flexible printed circuit boards, by blending a satd. polyester resin, a polyfunctional isocyanate compd. and an epoxy acrylate resin in a specified ratio. CONSTITUTION:85-40wt% satd. polyester resin (A) contg. at least 30mol% of an alkylene terephthalate component, 5-40wt% polyfunctional isocyanate compd. (B) such as isophorone diisocyanate and 5-25wt% epoxy acrylate resin (C) [e.g. a reaction product of polyepoxide with (meth)acrylic acid] are mixed together.
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