发明名称 Method for providing an electroless copper plating bath in the take mode.
摘要 <p>@ An electroless copper plating bath which is in the take mode is provided by determining the amount in the bath of at least four of the components selected from the group of oxygen, reducing agent, cyanide salt, cupric salt, and complexing agent, solving the equation:&lt;MathDetails id="matha01"&gt;&lt;MathText&gt;&lt;![CDATA[ &lt;img id="ia01" file="imga0001.tif" wi="52" he="14" img-content="math" img-format="tif" inline="no" /&gt; ]]&gt;&lt;/MathText&gt;&lt;/MathDetails&gt;wherein C is the concentration of cupric salt, A is the concentration of reducing agent, B is the concentration of oxygen, D is the concentration of cyanide salt, E is the concentration of complexing agent, and R is the calculated ratio.</p><p>The bath is provided with quantities of the above ingredients so that R in the equatio is between about 5 and about &lt;Sub&gt;15&lt;/Sub&gt; g.ppm.mg 1&lt;Sup&gt;2&lt;/Sup&gt;</p>
申请公布号 EP0150413(A1) 申请公布日期 1985.08.07
申请号 EP19840115621 申请日期 1984.12.17
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 KING, DAVID EDWARD;MARKOVICH, VOYA;SAMBUCETTI, CARLOS JUAN;TISDALE, STEPHEN LEO;TREVITT, DONNA JEAN
分类号 H05K3/18;C23C18/40;(IPC1-7):C23C18/40 主分类号 H05K3/18
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