| 摘要 |
PURPOSE:To attain uniform joining without foaming by using ultraviolet-ray curing resin as an adhesive between a glass substrate on which a metallic thin film for connection between a transparent electrode and a circuit substrate is formed and a filter glass provided with a striped transparent colored film, and irradiating them with ultraviolet rays from both side at the same time. CONSTITUTION:The glass substrate 1 on which a transparent conductive film 2 and a metallic thin film 3 for connection between a circuit substrate and the conductive film 2 and the filter glass 4 on which a transparent red film 5, green film 6, blue film 7, etc., are formed are adhered together by using the ultraviolet-ray curing resin 8. In this case, ultraviolet light sources 10 and 9 are provided at sides of the substrate 1 and filter glass 4, which are irradiated with ultraviolet rays at the same time and adhered together by curing the resin. Consequently, the adhesive at the part of the red film 5 is smaller in ultraviolet-ray intensity than the films 6 and 7 only by the irradiation from the light source 9, and the adhesive flows to the films 6 and 7 which shrink in curing to cause a deficiency, thereby forming foams. This phenomenon is prevented by irradiating both surfaces and decreasing the curing speed difference. |
