| 摘要 |
<p>There is disclosed a method for mounting chip carriers (26) on a printed circuit board (27); a method for preparing a compliant cast solder device (25a) as means for mounting the chip carriers (26) on the circuit board (27); a combination of a chip carrier (26) with a circuit board (27) secured by the disclosed means (25a) for mounting, securing, and electrically connecting the chip carriers (26), and a method of microinterconnection casting. Interconnections (31) extend on both sides of a plate and are formed as precision cast, relatively high temperature eutectic tin-lead alloy as cast columns (31c, 31d) lockingly engaged with the plate (25).</p> |
