Substrate with optical communications systems between chips mounted thereon.

摘要

The disclosure relates to a complex circuit composed of a circuit board (Silicon Mother Board) which is formed of crystal- fine elemental silicon in the form of a slice and circuit component in the form of semiconductor integrated circuits (Flip Chip) thereon which are preferably formed of a Group III-V compound. Signals from each of the integrated circuits are transmitted to other integrated circuits on the board or externally of the board either by conventional printed conductors on the board or, preferably, by means of a laser (TX) formed in each integrated circuit at each output terminal thereon which transmits light signals along light conducting members (Optical Link) in the silicon board to photo responsive elements (RX) at the input locations on other ones of the integrated circuits on the board for external to the board. The tight signal is transferred from an integrated circuit output to an integrated circuit input or to a device external to the board by means of light conducting members. These light conducting members may be light conducting rods positioned either on the surface of the board or in grooves formed therein. Alternatively, the light conducting members can be silicon dioxide paths formed in the silicon circuit board by selective oxidation of the silicon board to form silicon dioxide light conducting paths therein. Each light conducting path is coupled between a light emitting output from an integrated circuit and a light emitting input of another integrated circuit or travel to the edge of the circuit board for transmission external of the board.