| 摘要 |
PURPOSE:To encase components with good efficiency by a method wherein a plurality of frames provided with lead terminals and a pair of conduction terminals projecting outward from a framelike base are prepared, and conduction terminals of the same pole are joined into an integral body; then, components are loaded to the substrate part of the frame. CONSTITUTION:An oscillator 10 is loaded to supporting pieces 6-1 and 6-2 of the frame 2, and sides 3a and 3b of the substrate part 3 are fitted to the end surface 20a of a wall 20b of a case 20, and to the end surface 22a of a wall 22b of a case 22. A component 10 is housed to the space made by the recesses 21 and 23 of both cases, and the substrate part 3 is sandwiched between the end surfaces 20a and 22a under a prescribed pressure and then welded by conduction across a pair of the terminals 5-1 and 5-2. Next, the terminals 5-1 and 5-2 are cut across cutouts 7, and terminals 4-1-4-4 are folded toward the case side surface 20c. A plurality of frames 2 are joined at the wider joint F, and then fed all together to a required process and processed. This construction enables efficient encapsulation with high quality under the uniformity of welding state due to the uniform flow of welding current instead of the flow of unnecessary current to the electronic component 10 at the time of end surface welding of the resin case. |
