发明名称 LEAD FRAME FOR SEMICONDUCTOR IC DEVICE
摘要 PURPOSE:To prevent short-circuit failure by pulling up a loop by a method wherein the tip of an inner lead is positioned above the junction plane on the inner lead side. CONSTITUTION:The tip of the inner lead 12 is positioned above the junction plane on the inner lead side by press working, and then the lower end surface 15 of a linear loop is brought into contact at a higher position. This construction enables the loop to be higher as a whole at the time of loop formation, and edge contact failure and loop sag failure to be prevented by keeping the loop itself away from a pellet or an island.
申请公布号 JPS60149143(A) 申请公布日期 1985.08.06
申请号 JP19840005923 申请日期 1984.01.17
申请人 NIPPON DENKI KK 发明人 FUKUI YOSHIAKI
分类号 H01L21/60 主分类号 H01L21/60
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