| 摘要 |
PURPOSE:To equivalently reduce the lead wire length of the titled circuit by a method wherein the conduction part of a semiconductor package is made of common ground conductor by direct connection of the package to a dielectric substrate. CONSTITUTION:The conventional ground conductor is omitted by connecting conductive packages 1-1-1-3 containing semiconductor chips and input-output matching circuits directly to the dielectric substrate (lD thick), resulting in the reduction in the lengths of terminals 2-1-2-4 of the packages 1-1-1-3; then, adjacent package terminals 2-1-2-4 are connected by means of micro strip lines 3-1 and 3-2 (line length lS). At this time, the total length of connection lines of semiconductor components is reduced to 2lD+lS, and structural discontinuous points are reduced two points between packages 1-1-1-3 and the lines 3-1 and 3-2. Further, making the packages 1-1-1-3 of Au-plated kovar and the substrate of alumina ceramic makes the coefficient of linear expansion of each part approximately equal and appropriate. This construction realizes the reduction in member of discontinuous points of the circuit structure and the reduction in line length, resulting in the improvement in performance of this circuit. |
