| 摘要 |
<p>METAL-SEMICONDUCTOR RESISTIVE RIBBON FOR THERMAL TRANSFER PRINTING AND METHOD FOR USING A resistive ribbon for thermal transfer printing comprising a support layer bearing a fusible ink composition and a thin aluminum layer upon which is deposited a resistive layer of off-stoichiometric metal silicide is disclosed. Also disclosed are appropriate power sources for using the resistive ribbon, as well as methods for non-impact printing employing the disclosed ribbon.</p> |
