| 摘要 |
A modular connecting block comprising a block of insulating material having a plurality of apertures therein, each aperture having inserted therein a plurality of flat elongated conductive elements, the elements including at least one pair of opposing contact fingers which protrude upwardly from and are integral with a base portion of the elements, the contact fingers extending through said apertures to allow for connection of wires to the elements, the elements including a tang which is integral with and extends from the base of the element. The modular connecting block may be prewired and includes a plurality of conductive circuits which connect the tangs to various contact points which are positioned external to the block. In another embodiment of the invention the block comprises a parallelepiped having a projecting edge along the bottom of one longitudinal side thereof. The projecting edge is interrupted at a predetermined distance from one end thereof by a recess and at the same distance from the other end by a securing protrusion. The width of the recess is at least as great as the width of the securing protrusion so that when such two blocks are placed with their projecting edges in face to face contact, the protrusion of one will mate with the recess of the other.
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