METHOD OF SEALING WITH RESIN COMPOSITE ELECTRONIC PART,申请号JP19840005268-传众专利搜索

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发明名称	METHOD OF SEALING WITH RESIN COMPOSITE ELECTRONIC PART
摘要
申请公布号	JPS60149104(A)	申请公布日期	1985.08.06
申请号	JP19840005268	申请日期	1984.01.14
申请人	ROOMU KK	发明人	MORI TOSHIHIRO
分类号	H01C17/02;H01F5/00;H01F41/12;H01G4/224	主分类号	H01C17/02
代理机构		代理人
主权项
地址

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