发明名称 METHOD OF FORMING CONTACT ON FLEXIBLE BOARD PART
摘要 <p>Disclosed is a method of fabricating a novel printed circuit structure including a relatively small surface area of flexible material integral with a conventional glass epoxy carrier on which electrical contacts may be formed.</p>
申请公布号 JPS60148188(A) 申请公布日期 1985.08.05
申请号 JP19840219412 申请日期 1984.10.20
申请人 INTERN BUSINESS MACHINES CORP 发明人 ROORENSU MAACHIN BARUDOOFU;EDOWAADO JIYOSEFU GAABUAN;RICHIYAADO BURIYUUWAA OOBAAFUIIRUDO;GIRUBAATO CHIYAARUZU ROBAATSU
分类号 H01R12/04;H05K1/00;H05K3/00;H05K3/10;H05K3/24;H05K3/34;H05K3/40 主分类号 H01R12/04
代理机构 代理人
主权项
地址