| 摘要 |
PURPOSE:To obtain an in-line magnetic head suitable for an electronic camera by bonding steps of a couple of stepped cores provided with a coil window formed with a wafer through a prescribed process while being butted together and forming the cores after a spacer insertion slot is eliminated. CONSTITUTION:One face of the wafer 1 made of ''Sendust'' is polished, a coil window slot 3 of depth of t1 and a slot 2 are formed in parallel and silver solder 4 is packed in the slot 2. A titled face 3a is formed on one opening ridge of the slot 3. Plural parallel separating slots 5 deeper than the t1 orthogonal to the slots 2, 3 are formed and a spacer 6 is vapor-deposited on the surface between the slots 2 and 3. A wafer 7 having thickness smaller than the t1 is placed on the wafer 1 and melt-stuck by the silver solder 4, a hatched part 10 of a block 8 is removed, the block is sliced along broken lines 11 and a core chip 12 is obtained by applying thickness processing. The step of core chips 12A, 12B is butted and bonded, the part surrounded by broken lines 15 is removed, a spacer 19 is inserted to the slot 17 produced in this way and welded so as to remove the hatched part 21. The in-line magnetic head is obtained with cornering. |
