发明名称 PREPARATION OF BUFFER PACKING BASE MATERIAL
摘要 PURPOSE:To obtain an inexpensive buffer packing base material capable of being stored in a non-bulky state and having good workbility, by preliminarily forming a layer having a predetermined shape and comprising a non-foamed thermally foamable resin composition to the predetermined position of a base material in matching relation to the shape and dimension of the product to be packed. CONSTITUTION:A powder comprising a hot melt thermally foamable resin composition containing a foaming agent foaming by heating is preliminarily charged to one polarity. On the other hand, the predetermined position or whole of a base material sheet is charged to other polarity and the powder comprising said resin composition is adhered to the predetermined position of said sheet. The whole is heated to a temp. not decomposing the foaming agent contained in said powder but sufficient to melt the resin and pressed to secure the powder to the sheet in a molten state. By this method, because a buffer packing base material 14d, to which a layer comprising a non-foamed hot melt thermally foamable resin composition 29 having a predetermined shape is formed, is obtained, said base material is punched in a developed shape prior to foam the resin composition and folding lines 31 are formed.
申请公布号 JPS60147274(A) 申请公布日期 1985.08.03
申请号 JP19840001587 申请日期 1984.01.09
申请人 MATSUSHITA DENKI SANGYO KK;NITTO DENKI KOGYO KK 发明人 HOSOKAWA KAZUHIKO;MOTOHASHI SHIZUO;KIMURA SHIYOUZOU;ROKUSHIYA TADAHIRO;TOMINAGA TAKASHI;ASOSHINA HIDESHI;HORI MASAHIKO
分类号 B32B5/20;B05D1/06;B05D7/24 主分类号 B32B5/20
代理机构 代理人
主权项
地址