| 摘要 |
PURPOSE:To obtain the titled composition both low in the specific gravity and electrical resistance, of small settlement, which high shielding effect, by incorporating Ni-plated mica powder instead of Ni powder in thermoplastic and/or thermosetting resin. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of thermoplastic resin (e.g. acrylic resin) and/or thermosetting resin (e.g. epoxy resin) with (B) pref. 20-500pts.wt. of nickel-plated mica powder (pref. with a size <=80 mesh) and, if necessary, (C) filler pigment such as silicon oxide. In the incorporation of the component (B) in the component (B), it is recommended to use a diluent solvent such as methyl isobutyl ketone.
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