| 摘要 |
<p>PURPOSE:To prevent adverse influence due to heat and pressure upon an IC chip and to simplify manufacturing process by embedding an IC module in the hardened regin obtained by irradiating electron beams. CONSTITUTION:Jigs 17 (17a and 17b) in which a space 14 in correspondence to the desired card thickness is formed, is provided with an injecting port 15 and a flowing-out port 16 of an electron beam hardened resin. On the jig 17 an IC module 3 is fixed. Electron beam hardened resin is injected in the space 14 in the jig 17. After the electron beam hardened resin has been injected to the space 14, electron beams are irradiated to the electron beam hardened resin by an electron beam accelerator. Thus after the electron beam hardened resin has been hardened with electron beams, it is taken out from the jig 17, and punched into the desired shape if necessary. In order to increase mechanical strength of an IC card 1, an oversheet 18 is provided on both or single surface of a resin 2.</p> |
