| 摘要 |
PURPOSE:To improve the reliability of a bonded part by providing a process plating a metallic film to at least the bonded part on plural electrodes to improve the accuracy of the width of electrode fingers of the electrodes or the like. CONSTITUTION:The metallic film 12 made of such metal as aluminum is formed (b) on a piezoelectric substrate 11 made of LiNbO3 or the like, the 1st resist film 13 is coated and processed (c), the metallic film 12 is etched, a prescribed electrode 14 is formed and a resist film 13 is removed (d). Then the 2nd resist film 15 is coated and processed (e), the resist film 15 of a bonding part 1401 of the electrode 14 only is removed (f), Zn ions are absorbed on the surface of the aluminum vapor-deposition film of the bonding part 1401 to form (g) an Ni chemical plating film 17. Furthermore, the resist film 15 is exfoliated (h) and the surface acoustic wave device 19 having thick film only at the bonding part is formed. |
