| 摘要 |
PURPOSE:To bond in a relatively short time without using expensive gold by bonding a pellet of a semiconductor integrated circuit and a lead frame by laser light ray. CONSTITUTION:A lead frame 6 formed, for example, with mesh or slits is used to emit a laser light rays directly from below the lead frame which places a pellet 1 of a semiconductor integrated circuit. The pellet of the semiconductor integrated circuit has various sizes, but the hole area rate of the mesh or slits 7 of lattice shape of the portion for placing the pellet of the integrated circuit of the lead frame is sufficient with approx. 50%. Thus, the pellet 1 of the integrated circuit is placed on the lattice portion of the frame 6, a laser light ray is emitted fully to the part to place the lattice part of the leaf frame 6 and the pellet 1 of the integrated circuit and to die bond them. |
