| 摘要 |
PURPOSE:To uniformly heat even if a pattern is formed in any shape and density on a transparent substrate by bonding a film for absorbing a light on the back surface of the substrate heat treated by light heating. CONSTITUTION:When patterns 2, 3 of opaque films formed on a transparent substrate 1 are heated by a light heating method, a film 4 for absorbing a light is formed on the entire surface at the side having no patterns 2, 3 of the substrate 1 and heated with light. The film 4 is formed, for example, ith a polycrystalline silicon film. A lamp annealing may be performed from the side of the film 4 or from the opposite side. Thus, since the light not absorbed to the film 3 of small size is absorbed to the film 4, the films 2, 3 become the same temperature irrespective of the magnitude of the size. |
