| 摘要 |
PURPOSE:To obtain a sufficient bonding strength, by heating locally a part to be bonded of a lead without a metal plated layer for a short period directly before bonding it. CONSTITUTION:A lead 8 is heated at its local area to be bonded, by a heating device 9 for a short duration of time just before a metallic small-gage wire 11 is bonded to the lead 8, so that the bonding can be completed before the surface of the lead which is not plated with metal is oxidized excessively. Thus, the bonding can be provided with a strength equivalent to that of a metal-plated lead. The bonding strength may be further improved particularly by employing the ultrasonic bonding method while introducing a mixture gas of H2 and N2 as the atmosphere through pipes 3. |
