发明名称 DISCRETE ELECTRONIC COMPONENT
摘要 PURPOSE:To facilitate surface mounting without rolls during mounting by a method wherein the electronic component is shaped angular in appearance by forming the sealed part out of resin. CONSTITUTION:The device has both-end angluar electrodes 1a, 1b and leads 2a, 2b integrally fixed at right angles to the opposed surface sides of both electrodes 1a, 1b. These electrodes 1a, 1b and leads 2a, 2b are made of 42 alloy, kovar, or phosphor bronze. A pellet 3 of material such as silicon is installed to one 2a of the leads. After pellet mount and wire bonding, both the electrodes 1a, 1b are molded to each other angularly with a resin 5; and the pellet 3, a wire 4, and leads 2a, 2b are sealed. Therefore, a surface mount diode has the rectangular appearance as a whole.
申请公布号 JPS61177755(A) 申请公布日期 1986.08.09
申请号 JP19850018550 申请日期 1985.02.04
申请人 HITACHI TOKYO ELECTRONICS CO LTD;HITACHI LTD 发明人 MISAKI AKIO;OGURI KEIJI
分类号 H01L23/28;B22D11/10;H01L23/31 主分类号 H01L23/28
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