发明名称 JET TYPE SOLDER TANK
摘要 PURPOSE:To provide a titled solder tank which prevents warpage of a printed circuit board and has good working efficiency by the constitution in which comb tooth-shaped disc for preventing warpage of the printed circuit board provided in the gushing solder of a solder tank are turned to press smoothly the flow of the solder to the printed circuit board. CONSTITUTION:A jet type solder tank 1 solders the through-holes of a printed circuit board 6 on which packaging parts 6 are mounted and the leads of the parts 6 by guiding the flow of the gushing solder 2 packed in a solder tank 1 by plates 3, 4 for guiding the solder flow and bringing the rear of the board 5 into contact with the gushing solder 2. Plural comb tooth-shaped discs 9, 10 for preventing the warpage of the printed circuit board having shafts 8 are attached in the solder 2 to the side plates (not shown) of the above-mentioned tank 1 turnably in such a way that the outside circumferences thereof are positioned slightly below the top surface of the solder 2. The discs 9, 10 are respectively turned in arrow directions, by which the flow of the solder is quickly and smoothly pressed to the circuit board and the warpage of the board 5 is prevented.
申请公布号 JPS60145267(A) 申请公布日期 1985.07.31
申请号 JP19840002437 申请日期 1984.01.09
申请人 FUJITSU KK 发明人 KOBAYASHI TOSHIO;KUNISHIGE KENJI
分类号 B23K1/08;B23K3/06;(IPC1-7):B23K1/08 主分类号 B23K1/08
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