| 摘要 |
PURPOSE:To improve the efficiency of heat dissipation by isolating a high temperature section and a low-temperature heat dissipating section for a heat pipe in a box body, dampening a fin for heat dissipation for the low-temperature heat dissipating sectoin with water and forcibly vaporizing moisture when the heat pipe is coupled with a semiconductor in a termal conductive manner. CONSTITUTION:When the operation of a semiconductor 1 is suspended, a damper 12 for a box body 6 segregates a high temperature section and a low-temperature heat dissipating secton for a heat pipe 3, and prevents an intrusion to the high temperature section side of moisture on the low-temperature heat dissipating section side. An electric fan 10 is turned at the same time as the operation of the semiconductor 1, the velocity of air is adjusted while opening the damper 12 by air sucking in through a filter 18, and air is discharged through the low-temperature heat dissipating section. The vaporization of a water conducting material 15 is promoted by air passing through the low-temperature heat dissipating section during that time, and the heat pipe 3 quickly dissipates a large amount of heat in the low-temperature heat dissipating section. Accordingly, constitution in which a cooling device is isolated from the cooled electrical apparatus side is adopted, thus allowing safety operation at all times, then also removing energy required for operation. |
