发明名称 AMINO RESIN MOLDING MATERIAL
摘要 PURPOSE:To provide an amino resin molding material which gives moldings having improved crack resistance during heat resistance treatment and is suitable for use in the production of wiring equipment, electrical equipment, industrial articles, domestic articles, etc., by adding a butyral resin. CONSTITUTION:A thermosetting resin molding material is obtd. by adding 0.5- 30wt% (based on the total quantity of the material) butyral resin the an amino resin. Though the amino resin is excellent in colorability, surface hardness, etc., it has a disadvantage in that crack resistance during heat resistance treatment is poor. By adding the butyral resin, the crack resistance of the amino resin during heat resistance treatment can be improved by the plasticity and the toughness of the butyral resin.
申请公布号 JPS60144358(A) 申请公布日期 1985.07.30
申请号 JP19840001077 申请日期 1984.01.06
申请人 MATSUSHITA DENKO KK 发明人 ICHIKAWA MASAYA
分类号 C08L61/20;C08L61/00 主分类号 C08L61/20
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