| 摘要 |
PURPOSE:A curable resin composition excellent in solvent resistance, chemical resistance, heat resistance, etc., and suitable as a resist resin in chemical plating, obtained by further modifying a polydiene-modified epoxy resin with an ethylenically unsaturated compound and a thiol compound. CONSTITUTION:1 equivalent of a polydiene-modified polyepoxy resin of a number-average MW of 500-10,000, obtained by reacting a polydiene polymer having a carboxyl group or an isocyanate group on each molecular end with a polyepoxy resin is reacted with 0.5-3mol of a compound having one carboxyl group and at least one ethylenically unsaturated group adjacent to a carboxyl group in the molecule (e.g., acrylic acid), and 0.005-0.25mol of a thiol compound (e.g., 1,6-hexanediol). The titled curable resin composition is prepared by using the obtained thiol-modified unsaturated resin as a principal component.
|
