| 摘要 |
PURPOSE:To enable to securely perform all bondings by a method wherein the first opposed wiring is constituted in such a way that the first opposed wiring terminals, which are required to be of high precision in positioning, are mutually connected by performing a bonding in a film-carrier system, while the second opposed wiring is constituted in such a way that the second opposed wiring terminals, which might be comparatively loose in positioning precision, are mutually connected by performing a wire-bonding. CONSTITUTION:An electrical connection of the IC chips 4 and the heat generating part 2 of a heat-sensitive recording head 20 is performed over gaps 6 by a film-carrier tape 7 bridged over between a printed substrate 5 and a resistor substrate 3. At this time, when numerous wiring terminals 12a and 10a (first opposed wiring terminals) are accurately positioned and are bonded by the film- carrier tape 7, a positional shift, that IC control wiring terminals 12a' and 12a' (second opposed wiring terminals) deviate to each other in the (y) direction, generates. However, as the wiring terminals 12a and 12a' are securely connected by wires 17 with no bonding errors, all bondings can be performed securely. |
