发明名称 LIQUID-COOLING TYPE HIGH FREQUENCY SOLID-STATE DEVICE
摘要 PURPOSE:To enable to obtain an excellent heat radiating efficiency and to reduce amplitude modulation and a high frequency loss by a method wherein an electric wave absorbing material is interposed between the upper wall having a heat absorbing and radiating means, a heat generating semiconductor element and a matching circuit. CONSTITUTION:A heat radiating fin 23a is provided on the upper surface of the heat radiating block (upper wall) 23 which performs an additional function as a canopy. A recessed metal housing, an FET (heat generating semiconductor element) 28, which is mounted on a dielectric circuit substrate 27, and input-output matching circuits 29 and 30 are provided on a solid-state circuit part 25. An electric wave absorbing body 35 is formed in conical shape using the material such as ferrite and the like. The electromagnetic wave leaked out from the matching circuits 29 and 30 can be absorbed effectively by an electric wave absorbing body 35. The effect of reaction of the leakage electromagnetic wave generated by the boiling bubbles in a cooling liquid 24 can be suppressed, and an amplitude modulation can also be suppressed.
申请公布号 JPS60142550(A) 申请公布日期 1985.07.27
申请号 JP19830247693 申请日期 1983.12.29
申请人 FUJITSU KK 发明人 OOKUBO TAKAFUMI;SAITOU TOSHIYUKI;KANEKO YOSHIAKI;TOKUMITSU YASUYUKI
分类号 H05K9/00;H01L23/427;H01L23/44;H01L23/66;H01Q17/00 主分类号 H05K9/00
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