| 摘要 |
PURPOSE:To perform with ease the patterning of a evaporation-formed layer by a method wherein a second evaporation-formed film of Ni, Cr or the like is built at specific regions in a first film formed by evaporation on a substrate and the first evaporation-formed film comes off together with the second evaporation-formed film when the latter is peeled off. CONSTITUTION:A glass substrate 1 is heated, whereupon a first film, a transparent conductive film 3 for example, is formed by the evaporation method. The transparent conductive film 3 is formed of ITO, SnO2. A process follows wherein one or more of Ni, Cr, Ti, Mo, Pt is vaporized and, in the presence of a metal mask, selectively deposited at room temperatures on the transparent conductive film 3 for the formation of a metal film 4. When a piece of adhesive tape applied to the evaporation-formed film 4 is pulled, the portion of the transparent conductive film 3 positioned just below the metal film 4 peels off easily together with the metal film 4. The portion of the transparent conductive film 3 just below the metal film 4 stays when some pressure is applied downward across the metal film 4 by means of a pointed rod 5. This method applies to a film of SiO2 or Al deposited by evaporation on a metal substrate. This method is inferior to the photoetching method with regard to accuracy but this method accomplishes patterning by the evaporation method only.
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