| 摘要 |
PURPOSE:To obtain a highly reliable low melting solder alloy which permits connection at a low m.p., has excellent thermal fatigue resistance of the solder itself and prohibits embrittlement of the alloy layer by adding a specific amt. of Bi, Pb and Sb thereto. CONSTITUTION:A low-temp. solder alloy is formed by adding 0.02-2.5wt% Sb to a compsn. consisting of 13-20wt% Bi, 42-50wt% Pb and the balance Sn. The solder alloy which permits joining at the m.p. of Sn-40wt% Pb or below in the through-hole part of electronic parts such as a printed circuit board, hybrid circuit board, etc. or plane packaging thereof and has particularly excellent thermal fatigue resistance is thus obtd. |
