| 摘要 |
PURPOSE:The titled adhesive that is composed of a polyimide adhesive having a specific chemical structure for bonding semiconductor elements to the supports of inorganic materials, thus showing high adhesion and preventing the deformation of the supporting parts and the cracking of the semiconductor elements. CONSTITUTION:The objective adhesive is obtained by using (A) a polyimide containing the chemical structure of formula I (Ar is aromatic groups of formula II-IV; R is lower alkyl, fluorine-containing lower alkyl; n is 0-4) such as the one derived from p-phenylenediamine in a solvent such as N-methylpyrrodidone and, when necessary, (B) an electroconductive powder, an aromatic diamine. The resultant adhesive is applied between the semiconductor elements and the support and cured by heating. |
