发明名称 READILY BONDABLE AND ANTI-ELECTRIFICATION POLYESTER FILM
摘要 PURPOSE:To produce a film excellent in ready bondability and anti-electrification property etc., by applying an aqueous dispersion of a polyester resin having a special composition on the surface of an unstretched polyester film, and stretching the film. CONSTITUTION:A water-insoluble polyester copolymer (A) prepared from a glucose constituent and dicarboxylic acid constituents that contains a sulfonic acid metal salt in an amount of 0.5-15mol% based on the total amount of the dicarboxylic acid constituents, a water soluble organic compound (B) having a boiling point of 60-200 deg.C (e.g. butyl cellosolve, etc.), water (C), inorganic particles (D) (e.g. of aluminium silicate, etc.), a polyethylene glycol (E) and an anionic antistatic agent (F) are compounded with weight ratios of (A)/(B)=100/20-5,000, (B)/(C)=100/500-1,000, and (A)/(D)=100,000/0.5-3,000 into an aqueous dispersion of the polyester resin. The dispersion is applied on an unstretched polyester film, and the film is stretched to produce a readily bondable and anti-electrification film.
申请公布号 JPS60141525(A) 申请公布日期 1985.07.26
申请号 JP19830249947 申请日期 1983.12.28
申请人 TOYO BOSEKI KK 发明人 NOSE KATSUHIKO;SUZUKI HAJIME;MAKIMURA OSAMU
分类号 B32B27/36;B29C55/00;B29C55/02;B29K67/00;B29L9/00;C08J7/04 主分类号 B32B27/36
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