发明名称 |
LEISTUNGSHALBLEITERMODUL |
摘要 |
<p>A semiconductor power module includes a substrate formed of metallized ceramic, at least one semiconductor power component with a base surface soldered to the metallized ceramic, and at least one heat conduit integrated into the semiconductor power module. The heat conduit includes a condensation area having a larger surface than the base surface, over which dissipation heat from the semiconductor power component is distributed.</p> |
申请公布号 |
DE3402003(A1) |
申请公布日期 |
1985.07.25 |
申请号 |
DE19843402003 |
申请日期 |
1984.01.21 |
申请人 |
BROWN,BOVERI & CIE AG |
发明人 |
NEIDIG,ARNO,DIPL.-PHYS.DR.;BUNK,KLAUS;GOBRECHT,JENS,DIPL.-PHYS.DR. |
分类号 |
H01L23/34;H01L23/427;(IPC1-7):H01L23/42;H05K7/20 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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