| 摘要 |
A polyamide suitable as a hot-melt adhesive contains pendent graft copolymerized chains derived from aromatic compounds having an olefinically unsaturated moiety, e.g., styrene, lower methacrylates, epoxy-containing unsaturated compounds, acrylonitrile or methacrylonitrile, but contains no free graft comonomer. The polyamides show improved peel strengths, especially at low and high temperatures. The low temperature properties may be further improved by incorporating an elastomer, preferably a thermoplastic elastomer, part of which is compatible with the graft copolymerized chains. |
