| 摘要 |
<p>Thin wafers, such as slices of semiconductor silicon, are wax mounted to a carrier for polishing. The carrier is heated after being coated with wax, which is maintained in a sticky condition by the heated carrier. A chamber is used to enclose the thin wafers on resilient supports with the sticky, wax-coated, heated carrier disposed above them. The chamber has an airtight seal permitting it to be evacuated. After evacuation, a pneumatic cylinder is used to press the carrier against the wafers, which adhere to the sticky wax coating.</p> |
